- Hersteller：
-
- Comair Rotron (1)
- CUI Devices (1)
- Wakefield-Vette (2)
- Product Status：
-
- Material：
-
- Attachment Method：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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10 Aufzeichnungen
| Bild | Teil | Hersteller | Beschreibung | MOQ | Aktie | Aktion | |
|---|---|---|---|---|---|---|---|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-218/TO... |
1 |
3,933
In-stock
|
Erhalten Sie Zitat | ||
|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-220 PO... |
1 |
5,602
In-stock
|
Erhalten Sie Zitat | ||
|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-220 SO... |
1 |
2,470
In-stock
|
Erhalten Sie Zitat | ||
|
|
Aavid, Thermal Division of Boyd Corporation | HEAT SINK |
1 |
2,213
In-stock
|
Erhalten Sie Zitat | ||
|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
1 |
50,000
In-stock
|
Erhalten Sie Zitat | ||
|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
1 |
50,000
In-stock
|
Erhalten Sie Zitat | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
50,000
In-stock
|
Erhalten Sie Zitat | ||
|
|
Wakefield-Vette | HEATSINK TO-220 VE... |
1 |
50,000
In-stock
|
Erhalten Sie Zitat | ||
|
|
Wakefield-Vette | HEATSINK TO-220 VE... |
1 |
50,000
In-stock
|
Erhalten Sie Zitat | ||
|
|
Comair Rotron | HEATSINK STAMP 12... |
1 |
50,000
In-stock
|
Erhalten Sie Zitat |
