- Hersteller：
-
- CUI Devices (3)
- Wakefield-Vette (2)
- Type：
-
- Attachment Method：
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- Package Cooled：
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- Fin Height：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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8 Aufzeichnungen
| Bild | Teil | Hersteller | Beschreibung | MOQ | Aktie | Aktion | |
|---|---|---|---|---|---|---|---|
|
Assmann WSW Components | HEATSINK CPU XCU... |
1 |
1,509
In-stock
|
Erhalten Sie Zitat | ||
|
|
Assmann WSW Components | CPU HEATSINK, CRO... |
1 |
1,733
In-stock
|
Erhalten Sie Zitat | ||
|
|
CUI Devices | HEAT SINK, BGA, 23 ... |
1 |
1,708
In-stock
|
Erhalten Sie Zitat | ||
|
|
CUI Devices | HEAT SINK, BGA, 23 ... |
1 |
4
In-stock
|
Erhalten Sie Zitat | ||
|
|
CUI Devices | HEAT SINK, BGA, 23 ... |
1 |
1,408
In-stock
|
Erhalten Sie Zitat | ||
|
|
Wakefield-Vette | ANCHOR HEATSINK ... |
1 |
319
In-stock
|
Erhalten Sie Zitat | ||
|
|
Wakefield-Vette | ANCHOR HEATSINK ... |
1 |
986
In-stock
|
Erhalten Sie Zitat | ||
|
|
Assmann WSW Components | CPU HEATSINK, CRO... |
1 |
50,000
In-stock
|
Erhalten Sie Zitat |
