HSB23-232325

Hersteller :

CUI Devices

Produktkategorie :

Thermal - Kühlkörper

Attachment Method :

Adhesive

Diameter :

-

Fin Height :

0.984" (25.00mm)

Length :

0.906" (23.00mm)

Material :

Aluminum Alloy

Material Finish :

Black Anodized

Package Cooled :

BGA

Power Dissipation @ Temperature Rise :

6.13W @ 75°C

Product Status :

Active

Shape :

Square, Pin Fins

Thermal Resistance @ Forced Air Flow :

3.80°C/W @ 200 LFM

Thermal Resistance @ Natural :

12.23°C/W

Type :

Top Mount

Width :

0.906" (23.00mm)