HSB27-434316

Hersteller :

CUI Devices

Produktkategorie :

Thermal - Kühlkörper

Attachment Method :

Adhesive

Diameter :

-

Fin Height :

0.650" (16.51mm)

Length :

1.697" (43.10mm)

Material :

Aluminum Alloy

Material Finish :

Black Anodized

Package Cooled :

BGA

Power Dissipation @ Temperature Rise :

8.98W @ 75°C

Product Status :

Active

Shape :

Square, Pin Fins

Thermal Resistance @ Forced Air Flow :

2.80°C/W @ 200 LFM

Thermal Resistance @ Natural :

8.35°C/W

Type :

Top Mount

Width :

1.697" (43.10mm)