DILB24P-223TLF

Hersteller :

Amphenol CS (FCI)

Produktkategorie :

Sockel für ICs, Transistoren

Contact Finish - Mating :

Tin-Lead

Contact Finish - Post :

Tin-Lead

Contact Finish Thickness - Mating :

100.0µin (2.54µm)

Contact Finish Thickness - Post :

100.0µin (2.54µm)

Contact Material - Mating :

Copper Alloy

Contact Material - Post :

Copper Alloy

Features :

Open Frame

Housing Material :

Polyamide (PA), Nylon

Mounting Type :

Through Hole

Number of Positions or Pins (Grid) :

24 (2 x 12)

Operating Temperature :

-55°C ~ 125°C

Pitch - Mating :

0.100" (2.54mm)

Pitch - Post :

0.100" (2.54mm)

Product Status :

Active

Termination :

Solder

Type :

DIP, 0.6" (15.24mm) Row Spacing