DILB28P-223TLF
- Herst.Teilenummer
- DILB28P-223TLF
- Hersteller
- Amphenol CS (FCI)
- Paket/Fall
- -
- Datenblatt
- Download
- Beschreibung
- CONN IC DIP SOCKET 28POS TIN
- Aktie:
- Auf Lager
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- Hersteller :
- Amphenol CS (FCI)
- Produktkategorie :
- Sockel für ICs, Transistoren
- Contact Finish - Mating :
- Tin
- Contact Finish - Post :
- Tin
- Contact Finish Thickness - Mating :
- 100.0µin (2.54µm)
- Contact Finish Thickness - Post :
- 100.0µin (2.54µm)
- Contact Material - Mating :
- Copper Alloy
- Contact Material - Post :
- Copper Alloy
- Features :
- Open Frame
- Housing Material :
- Polyamide (PA), Nylon
- Mounting Type :
- Through Hole
- Number of Positions or Pins (Grid) :
- 28 (2 x 14)
- Operating Temperature :
- -55°C ~ 105°C
- Pitch - Mating :
- 0.100" (2.54mm)
- Pitch - Post :
- 0.100" (2.54mm)
- Product Status :
- Active
- Termination :
- Solder
- Type :
- DIP, 0.6" (15.24mm) Row Spacing
- Datenblätter
- DILB28P-223TLF
