BMI-C-001

Hersteller :

Laird Technologies EMI

Produktkategorie :

RFI und EMI – Kontakte, Fingerstock und Dichtungen

Attachment Method :

Solder

Height :

0.096" (2.44mm)

Length :

0.122" (3.11mm)

Material :

Beryllium Copper

Operating Temperature :

-

Plating :

Gold

Plating - Thickness :

-

Product Status :

Active

Shape :

-

Type :

Fingerstock

Width :

0.078" (2.00mm)