BMI-C-004-SN

Hersteller :

Laird Technologies EMI

Produktkategorie :

RFI und EMI – Kontakte, Fingerstock und Dichtungen

Attachment Method :

Solder

Height :

0.204" (5.17mm)

Length :

0.235" (5.97mm)

Material :

Beryllium Copper

Operating Temperature :

-

Plating :

Tin

Plating - Thickness :

-

Product Status :

Active

Shape :

-

Type :

Shield Finger

Width :

0.170" (4.32mm)