BMI-C-007-01

Hersteller :

Laird Technologies EMI

Produktkategorie :

RFI und EMI – Kontakte, Fingerstock und Dichtungen

Attachment Method :

Solder

Height :

0.126" (3.20mm)

Length :

0.130" (3.30mm)

Material :

Beryllium Copper

Operating Temperature :

-

Plating :

Tin

Plating - Thickness :

-

Product Status :

Active

Shape :

-

Type :

Fingerstock

Width :

0.059" (1.50mm)