- Product Status：
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- Shape：
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- Width：
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- Length：
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- Attachment Method：
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- Package Cooled：
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- Fin Height：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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- Filter：
167 Aufzeichnungen
| Bild | Teil | Hersteller | Beschreibung | MOQ | Aktie | Aktion | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
50,000
In-stock
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CUI Devices | HEAT SINK, STAMPI... |
1 |
50,000
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CUI Devices | HEAT SINK, BGA, 33.... |
1 |
1,280
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|
CUI Devices | HEAT SINK, BGA, 28.... |
1 |
1,728
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CUI Devices | HEAT SINK, EXTRUS... |
1 |
1,584
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|
CUI Devices | HEAT SINK, BGA, 23 ... |
1 |
1,408
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CUI Devices | HEAT SINK, EXTRUS... |
1 |
50,000
In-stock
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CUI Devices | HEAT SINK, EXTRUS... |
1 |
50,000
In-stock
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|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
1,584
In-stock
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|
CUI Devices | HEAT SINK, BGA, 37.... |
1 |
50,000
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|
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CUI Devices | HEAT SINK, EXTRUS... |
1 |
50,000
In-stock
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CUI Devices | HEAT SINK, EXTRUS... |
1 |
50,000
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CUI Devices | HEAT SINK, BGA, 43.... |
1 |
1,155
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CUI Devices | HEAT SINK, EXTRUS... |
1 |
50,000
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CUI Devices | HEATSINK TO-220 2.6W... |
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749
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1 |
497
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2,009
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CUI Devices | HEAT SINK, BGA, 27 ... |
1 |
472
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CUI Devices | HEAT SINK, EXTRUS... |
1 |
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CUI Devices | HEAT SINK, BGA, 30.... |
1 |
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